AI-CLUSTER QUALITY SYSTEM

Wireless & IoT

Custom wire harnesses and cable assemblies for wireless and IoT devices — fine-pitch sensor harnesses, module and board-to-board interconnect, battery and power harnesses, display and UI wiring, and sealed industrial-IoT field cordsets. Engineered and 100% electrically tested in Taiwan since 1998.

Conn pitch
0.5mm
Wire
to 32AWG
Lead
3weeks
MOQ
50pcs
100% E-TESTED
IOT-GRADE QUALITY SYSTEMISO 9001:2015IPC/WHMA-A-620100% ELECTRICAL TESTRoHS · REACH🇹🇼 MADE IN TAIWAN

What We Build For Wireless & IoT

Connected devices are getting smaller and shipping by the million. The interconnect inside has to be fine-pitch, repeatable, and cheap at volume. For twenty-eight years we've built sensor, power and board-to-board harnesses for IoT, edge and M2M device makers.

The same line in Taiwan wires all of it — from a feasibility sample to high-volume device runs. Send a sketch, a BOM, or a connector callout, and we return a design-for-manufacture review in three business days.

The same line in Taiwan wires all of it — from a feasibility sample to cluster-scale volumes. Send a sketch, a BOM, or a competitor sample, and we return a design-for-manufacture review in three business days.

Coverage
Sensor · Power · B2Bfine-pitch · FFC · IIoT cordset
Volume sweet spot
500 – 100K /yrdevice volumes scale higher
First-call SLA
1 business dayengineering, not sales
Workflow
DFM → Sample → PPAPfine-pitch crimp validation

Wireless & IoT Cable Assembly Applications.

Need Custom Cable Assembly or Wire Harnesses?

Working on a custom project and searching for a trusted manufacturer? Reach out to us for a rapid engineering evaluation and a detailed quote within 24 hours.

Request Custom Quote
HARNESS FAMILIES

3 Product Families Do Most Of The IoT Work.

SEN-01 · FINE-PITCH

IoT sensor & power harness

Fine-pitch sensor, power and signal harnesses on 0.5–2.0 mm pitch. JST or Molex, polarized and keyed for high-volume assembly.

Gauge28–32 AWG
ConnectorJST · Molex
Pitch0.5–2.0 mm
Test100%
B2B-02 · INTERCONNECT

Board-to-board / FFC interconnect

FFC / FPC ribbon and discrete board-to-board links for compact device stacks. Hirose or JAE, length-matched.

TypeFFC · FPC
ConnectorHirose · JAE
Pitch0.5–1.0 mm
Test100%
IIoT-03 · FIELD

Industrial-IoT field cordset

Sealed M12 / M8 cordsets for IIoT field sensors and edge gateways. Overmolded to IP67 / IP68.

Gauge20–24 AWG
ConnectorM12 · M8
SealIP67/68
Testseal · 100%
SPECIFICATION

Wireless & IoT Assembly Specifications — Baseline.

ELECTRICAL · MECHANICALTWT-01.E

Conductor Stranded tinned Cu
Wire gauge 38 – 22 AWGfine-pitch
Insulation PVC · PE · FEP · siliconeper drawing
Connector pitch 0.5 · 1.0 · 1.25 · 2.0 mm
Voltage class to 112 Gbps PAM4≤ 60 V DC
Flat-flex FFC / FPC0.5–1.0 mm pitch
Bend radius 4 × OD min
Shielding foil / braid option

ENVIRONMENTAL · QUALIFICATIONTWT-01.Q

Op temperature −40 / +85 °C
Storage temp −40 / +105 °C
Protection IP67 / IP68IIoT cordset option
Hi-pot 500 V AC / 1 s
Insulation R LSZHjacketoption
Halogen-free 500 V AC / 1 s1000 V option
Flammability UL 94 V-0jacket option
RoHS · REACH Compliantdeclaration with CoC

QUALITY · DOCUMENTATIONTWT-01.D

Cert ISO 9001:2015IPC/WHMA-A-620 workmanship
Test coverage 100% e-testfine-pitch crimp validation
PPAP Level 2 standardLevel 3 on request
FAI First Article Inspectiondimensional + electrical test
Documentation CoC · CoA · RoHS · IPCfull data pack on request
Traceability lot-levelserial on request

COMMERCIAL · LOGISTICSTWT-01.C

MOQ · prototype 50 pcs1–10 at sample rate
NRE / tooling $0 – $500amortized on volume
Sample lead Week 1
Production lead 3 weeks1 wk on expedite
Volume sweet spot 500 – 100K /yr
Bonded inventory LA, USmonthly delivery schedule
Packaging reel · tray · bagper drawing
Incoterms EXW · FOB · DDP
Engineering process

Sketch To Shipment On One Floor

The same engineering team carries your part from the bench through PPAP and into production. No handoffs to another factory.

01
Day 1

Drawing review

Send a sketch, BOM, connector callout, or pinout. Engineering replies within one business day with first-pass feasibility.

FeasibilityInitial pricingDFM questions
02
Days 2–4

DFM feedback

Connector pitch, wire gauge, FFC vs discrete and strain-relief alternates. Tooling and NRE quote included in the first round, marked on your drawing.

DFM markupTooling quoteMaterial BOM
03
Week 1

Sample build

Single-unit or small-batch on the production line, 100% electrical-tested before shipment. Test data and photos sent before pickup.

Sample(s)Test reportPhotos
04
Weeks 2–3

PPAP / First Article

Dimensional, electrical and materials reports included. Customer drawing markup approval before production release.

PPAP 2 / 3First ArticleMaterial certs
05
Week 3+

Production

100% electrical test on every assembly. Packaged, labeled and shipped per drawing. Optional LA-bonded inventory for monthly delivery schedules.

Serialized partsTest recordCoC / CoA

Build Your Cable Assembly

Have a drawing or a BOM? Fill out the form. Our engineers review every submission to ensure manufacturability and provide a quick quote.

Engineering review within 24 hours
No Minimum Order Quantity (MOQ) for prototypes
ISO 9001:2015 Compliant Assembly
100% Electrically Tested
Material Certifications (RoHS/REACH) Available
Unlimited Customization Options
Cost-Efficient Scaling to Production
Premium Quality: Made in Taiwan

Request a Quote

Frequently asked questions

What connector pitches can you build to?

We build fine-pitch harnesses on 0.5, 1.0, 1.25 and 2.0 mm pitch with crimp validation on every lot. Wire gauges run to 32 AWG (finer on request) for compact connected-device assembly.

Do you build FFC / FPC and board-to-board links?

Yes. FFC / FPC ribbon and discrete board-to-board interconnect for compact device stacks, with Hirose, JAE and Molex connector systems, length-matched for signal integrity.

What's the minimum order quantity (MOQ)?

50 pieces for a typical data-center assembly. Prototype runs of 1–10 units are billed at sample rate and ship in the first week, so you can validate signal integrity before a production lot.

Can you build sealed industrial-IoT field cordsets?

Yes. Overmolded M12 / M8 cordsets sealed to IP67 / IP68 for IIoT field sensors and edge gateways, in any length, seal- and continuity-tested.

Which connector systems do you terminate?

We hold dies and termination specs for JST, Molex, Hirose, and JAE — including fine-pitch wire-to-board, FFC / FPC and M8 / M12 systems. For proprietary parts, send three free samples and we'll cut dies in week one.

Do you build liquid-cooling harnesses?

Yes. Sensor, leak-detection, and valve-control wiring for CDU and cold-plate manifolds, with sealed / IP-rated terminations where the harness sees coolant proximity. All 100% electrically tested.