INDUSTRY APPLICATION

Data Center

Custom high-speed cable assemblies and wire harnesses for hyperscale and enterprise data centers — QSFP-DD and OSFP direct-attach copper, internal NVMe and MiniSAS storage links, GPU and rack power whips, and backplane interconnect. Engineered and 100% electrically tested in Taiwan since 1998.

Lane rate
112Gbps PAM4
Skew match
≤ 5ps
Lead
3weeks
MOQ
50pcs
HYPERSCALE-READY QUALITY SYSTEMISO 9001:2015IPC/WHMA-A-620100% ELECTRICAL TESTRoHS · REACH🇹🇼 MADE IN TAIWAN

What We Build For Data Centers.

Inside the rack, signal integrity is everything. We've built high-speed copper and power assemblies for server OEMs, switch makers, and hyperscale integrators for twenty-eight years — DAC, internal storage links, and power whips that hold their margin at 112 Gbps.

Our data-center practice spans top-of-rack DAC and breakout, internal NVMe / PCIe and MiniSAS storage interconnect, GPU and busbar power, backplane and board-to-board links, and fan / management harnesses — high-speed signal and high-current power on one bill of materials.

The same line in Taiwan wires all of it — from a feasibility sample to rack-scale volumes. Send a sketch, a BOM, or a competitor sample, and we return a design-for-manufacture review in three business days.

Coverage
DAC · Storage · Powerhigh-speed + high-current
Volume sweet spot
100 – 50K /yrrack-scale volumes scale higher
First-call SLA
1 business dayengineering, not sales
Workflow
DFM → Sample → PPAP100% e-test + TDR / eye on request

Need Custom Cable Assembly or Wire Harnesses?

Working on a custom project and searching for a trusted manufacturer? Reach out to us for a rapid engineering evaluation and a detailed quote within 24 hours.

Request Custom Quote
HARNESS FAMILIES

3 Product Families Do Most Of The Data Center Work.

HS-01 · DAC

High-speed DAC

Passive QSFP-DD / OSFP direct-attach copper, 26–30 AWG twinax, length- and skew-matched for 400 / 800G top-of-rack.

Rate112 Gbps
ConnectorQSFP-DD
Skew≤ 5 ps
Reach< 3 m
ST-02 · STORAGE

Internal storage interconnect

SlimSAS, MCIO and MiniSAS HD links for NVMe, U.2 / U.3 and PCIe Gen5 backplanes. Length-matched, signal-integrity verified.

Gauge30–34 AWG
ConnectorSlimSAS · MCIO
Rate32 GT/s
Test100%
PWR-03 · POWER

Rack & GPU power harness

12VHPWR GPU power, EPS, and C13 / C19 PDU whips with per-pin current balancing and crimp pull-test.

Gauge10–16 AWG
Connector12VHPWR · IEC
Power≤ 600 W
Testhi-pot
SPECIFICATION

Data Center Assembly Specifications — Baseline.

ELECTRICAL · MECHANICALTWT-01.E

Conductor Bare / tinned Cusilver-plated for high-speed
Wire gauge 34 – 10 AWGtwinax / discrete / power
Insulation FEP · foam PE · PVC · LSZHper drawing
Impedance 85 / 100 Ω diff± 5% controlled
Data Rate to 112 Gbps PAM4per lane
Skew match ≤ 5 psintra-pair
Shielding twinax foil · braidup to 95%
Color code per drawing

ENVIRONMENTAL · QUALIFICATIONTWT-01.Q

Op temperature 0 / +70 °C-40 / +85 °C option
Storage temp −55 / +85 °C
Flammability CM · CMR · CMPLSZH option
Insertion loss per specswept on request
Hi-pot 500 V AC / 1 s1000 V option
Insulation R ≥ 500 MΩ
Current Rating per UL 758bundle derating
RoHS · REACH Compliantdeclaration with CoC

QUALITY · DOCUMENTATIONTWT-01.D

Cert ISO 9001:2015IPC/WHMA-A-620 workmanship
Test coverage 100% e-testTDR · eye on request
PPAP Level 2 standardLevel 3 on request
FAI First Article Inspectiondimensional + electrical test
Documentation CoC · CoA · RoHS · IPCfull data pack on request
Traceability lot-levelserial on request

COMMERCIAL · LOGISTICSTWT-01.C

MOQ · prototype 50 pcs1–10 at sample rate
NRE / tooling $0 – $600amortized on volume
Sample lead Week 1
Production lead 3 weeks1 wk on expedite
Volume sweet spot 100 – 50K /yr
Bonded inventory LA, USmonthly delivery schedule
Packaging ESD bag · reel · trayper drawing
Incoterms EXW · FOB · DDP

Build Your Cable Assembly

Have a drawing or a BOM? Fill out the form. Our engineers review every submission to ensure manufacturability and provide a quick quote.

Engineering review within 24 hours
No Minimum Order Quantity (MOQ) for prototypes
ISO 9001:2015 Compliant Assembly
100% Electrically Tested
Material Certifications (RoHS/REACH) Available
Unlimited Customization Options
Cost-Efficient Scaling to Production
Premium Quality: Made in Taiwan

Request a Quote

Engineering process

Sketch To Shipment On One Floor

The same engineering team carries your part from the bench through PPAP and into production. No handoffs to another factory.

01
Day 1

Drawing review

Send a sketch, BOM, competitor sample, or pinout. Engineering replies within one business day with first-pass feasibility.

FeasibilityInitial pricingDFM questions
02
Days 2–4

DFM feedback

Impedance and skew targets, shield system, connector and backshell alternates. Tooling and NRE quote included in the first round, marked on your drawing.

DFM markupTooling quoteMaterial BOM
03
Week 1

Sample build

Single-unit or small-batch on the production line, 100% electrical-tested with TDR / eye on request before shipment. Test data sent before pickup.

Sample(s)Test reportPhotos
04
Weeks 2–3

PPAP / First Article

Dimensional, electrical and materials reports included. Customer drawing markup approval before production release.

PPAP 2 / 3First ArticleMaterial certs
05
Week 3+

Production

100% electrical test on every assembly. Packaged, labeled and shipped per drawing. Optional LA-bonded inventory for monthly delivery schedules.

Serialized partsTest recordCoC / CoA

Frequently asked questions

Can you build 400 / 800G DAC and breakout cables?

Yes. We build passive QSFP-DD and OSFP direct-attach copper and 1×4 / 1×8 breakouts, length- and skew-matched (≤ 5 ps). Every assembly is 100% electrically tested, with TDR and eye-diagram data available on request.

What's the minimum order quantity (MOQ)?

50 pieces for a typical data-center assembly. Prototype runs of 1–10 units are billed at sample rate and ship in the first week, so you can validate signal integrity before a production lot.

Do you build internal NVMe / PCIe Gen5 interconnect?

Yes. SlimSAS and MCIO links for U.2 / U.3 and PCIe Gen5 risers and backplanes, length-matched and TDR-verified. We also build MiniSAS HD (SFF-8643 / 8644) for SAS storage.

Which connector systems do you terminate?

We hold dies and termination specs for TE Connectivity, Molex, Amphenol, Samtec, JAE, and Hirose, plus standard data-center form factors (QSFP-DD, OSFP, SlimSAS, MCIO, MiniSAS HD, 12VHPWR). For proprietary parts, send three free samples and we'll cut dies in week one.

How fast will I hear back on an RFQ?

Our engineering team replies to quote requests within one business day, including feasibility, a tooling/NRE estimate where relevant, and a sample lead time. Send a drawing, BOM, or a description of the application to start.