Data Center Cable Assembly
Custom high-speed cable assemblies and wire harnesses for hyperscale and enterprise data centers — QSFP-DD and OSFP direct-attach copper, internal NVMe and MiniSAS storage links, GPU and rack power whips, and backplane interconnect. Engineered and 100% electrically tested in Taiwan since 1998.
What We Build For Data Centers.
Inside the rack, signal integrity is everything. We've built high-speed copper and power assemblies for server OEMs, switch makers, and hyperscale integrators for twenty-eight years — DAC, internal storage links, and power whips that hold their margin at 112 Gbps.
Our data-center practice spans top-of-rack DAC and breakout, internal NVMe / PCIe and MiniSAS storage interconnect, GPU and busbar power, backplane and board-to-board links, and fan / management harnesses — high-speed signal and high-current power on one bill of materials.
The same line in Taiwan wires all of it — from a feasibility sample to rack-scale volumes. Send a sketch, a BOM, or a competitor sample, and we return a design-for-manufacture review in three business days.
Need Custom Cable Assembly or Wire Harnesses?
Working on a custom project and searching for a trusted manufacturer? Reach out to us for a rapid engineering evaluation and a detailed quote within 24 hours.
3 Product Families Do Most Of The Data Center Work.
High-speed DAC
Passive QSFP-DD / OSFP direct-attach copper, 26–30 AWG twinax, length- and skew-matched for 400 / 800G top-of-rack.
Internal storage interconnect
SlimSAS, MCIO and MiniSAS HD links for NVMe, U.2 / U.3 and PCIe Gen5 backplanes. Length-matched, signal-integrity verified.
Rack & GPU power harness
12VHPWR GPU power, EPS, and C13 / C19 PDU whips with per-pin current balancing and crimp pull-test.
Data Center Assembly Specifications — Baseline.
ELECTRICAL · MECHANICALTWT-01.E
ENVIRONMENTAL · QUALIFICATIONTWT-01.Q
QUALITY · DOCUMENTATIONTWT-01.D
COMMERCIAL · LOGISTICSTWT-01.C
Build Your Cable Assembly
Have a drawing or a BOM? Fill out the form. Our engineers review every submission to ensure manufacturability and provide a quick quote.
Request a Quote
Sketch To Shipment On One Floor
The same engineering team carries your part from the bench through PPAP and into production. No handoffs to another factory.
Drawing review
Send a sketch, BOM, competitor sample, or pinout. Engineering replies within one business day with first-pass feasibility.
DFM feedback
Impedance and skew targets, shield system, connector and backshell alternates. Tooling and NRE quote included in the first round, marked on your drawing.
Sample build
Single-unit or small-batch on the production line, 100% electrical-tested with TDR / eye on request before shipment. Test data sent before pickup.
PPAP / First Article
Dimensional, electrical and materials reports included. Customer drawing markup approval before production release.
Production
100% electrical test on every assembly. Packaged, labeled and shipped per drawing. Optional LA-bonded inventory for monthly delivery schedules.
Our Manufacturing Divisions
We segment our production lines to optimize for the distinct engineering requirements of internal chassis routing versus external environmental exposure.
Wire Harness Production
Internal Routing & Chassis Wiring
Rack and GPU power whips plus internal distribution harnesses, built for airflow, service access, and high current-carrying demands.
Custom Cable Assemblies
External & Ruggedized Applications
QSFP-DD/OSFP DAC, internal NVMe/PCIe and MiniSAS storage links, and backplane interconnect that hold their signal margin at 112 Gbps.
Engineers From These Verticals Also Build With Us.
Automotive
Automotive Ethernet, CAN/LIN, infotainment and body-electronics harnesses for in-vehicle systems.
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Medical
Diagnostic, monitoring and medical-device interconnect, built and 100% tested
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Aerospace
Cabin/IFE, GSE, avionics-test and UAS/eVTOL harnesses with sealed databus interconnect.
VIEW →Frequently asked questions
Can you build 400 / 800G DAC and breakout cables?
Yes. We build passive QSFP-DD and OSFP direct-attach copper and 1×4 / 1×8 breakouts, length- and skew-matched (≤ 5 ps). Every assembly is 100% electrically tested, with TDR and eye-diagram data available on request.
What's the minimum order quantity (MOQ)?
50 pieces for a typical data-center assembly. Prototype runs of 1–10 units are billed at sample rate and ship in the first week, so you can validate signal integrity before a production lot.
Do you build internal NVMe / PCIe Gen5 interconnect?
Yes. SlimSAS and MCIO links for U.2 / U.3 and PCIe Gen5 risers and backplanes, length-matched and TDR-verified. We also build MiniSAS HD (SFF-8643 / 8644) for SAS storage.
Which connector systems do you terminate?
We hold dies and termination specs for TE Connectivity, Molex, Amphenol, Samtec, JAE, and Hirose, plus standard data-center form factors (QSFP-DD, OSFP, SlimSAS, MCIO, MiniSAS HD, 12VHPWR). For proprietary parts, send three free samples and we'll cut dies in week one.
How fast will I hear back on an RFQ?
Our engineering team replies to quote requests within one business day, including feasibility, a tooling/NRE estimate where relevant, and a sample lead time. Send a drawing, BOM, or a description of the application to start.