Wireless & IoT Cable Assembly
Custom wire harnesses and cable assemblies for wireless and IoT devices — fine-pitch sensor harnesses, module and board-to-board interconnect, battery and power harnesses, display and UI wiring, and sealed industrial-IoT field cordsets. Engineered and 100% electrically tested in Taiwan since 1998.
What We Build For Wireless & IoT
Connected devices are getting smaller and shipping by the million. The interconnect inside has to be fine-pitch, repeatable, and cheap at volume. For twenty-eight years we've built sensor, power and board-to-board harnesses for IoT, edge and M2M device makers.
The same line in Taiwan wires all of it — from a feasibility sample to high-volume device runs. Send a sketch, a BOM, or a connector callout, and we return a design-for-manufacture review in three business days.
The same line in Taiwan wires all of it — from a feasibility sample to cluster-scale volumes. Send a sketch, a BOM, or a competitor sample, and we return a design-for-manufacture review in three business days.
Need Custom Cable Assembly or Wire Harnesses?
Working on a custom project and searching for a trusted manufacturer? Reach out to us for a rapid engineering evaluation and a detailed quote within 24 hours.
3 Product Families Do Most Of The IoT Work.
IoT sensor & power harness
Fine-pitch sensor, power and signal harnesses on 0.5–2.0 mm pitch. JST or Molex, polarized and keyed for high-volume assembly.
Board-to-board / FFC interconnect
FFC / FPC ribbon and discrete board-to-board links for compact device stacks. Hirose or JAE, length-matched.
Industrial-IoT field cordset
Sealed M12 / M8 cordsets for IIoT field sensors and edge gateways. Overmolded to IP67 / IP68.
Wireless & IoT Assembly Specifications — Baseline.
ELECTRICAL · MECHANICALTWT-01.E
ENVIRONMENTAL · QUALIFICATIONTWT-01.Q
QUALITY · DOCUMENTATIONTWT-01.D
COMMERCIAL · LOGISTICSTWT-01.C
Our Manufacturing Divisions
We segment our production lines to optimize for the distinct engineering requirements of internal chassis routing versus external environmental exposure.
Wire Harness Production
Internal Routing & Chassis Wiring
Compact internal harnesses for gateways, sensors, and edge devices — power and signal looms routed for tight enclosures and antenna placement.
Custom Cable Assemblies
External & Ruggedized Applications
RF and antenna cable assemblies (coax, U.FL / SMA) plus sealed IP67 sensor cordsets for outdoor IoT deployments.
Sketch To Shipment On One Floor
The same engineering team carries your part from the bench through PPAP and into production. No handoffs to another factory.
Drawing review
Send a sketch, BOM, connector callout, or pinout. Engineering replies within one business day with first-pass feasibility.
DFM feedback
Connector pitch, wire gauge, FFC vs discrete and strain-relief alternates. Tooling and NRE quote included in the first round, marked on your drawing.
Sample build
Single-unit or small-batch on the production line, 100% electrical-tested before shipment. Test data and photos sent before pickup.
PPAP / First Article
Dimensional, electrical and materials reports included. Customer drawing markup approval before production release.
Production
100% electrical test on every assembly. Packaged, labeled and shipped per drawing. Optional LA-bonded inventory for monthly delivery schedules.
Build Your Cable Assembly
Have a drawing or a BOM? Fill out the form. Our engineers review every submission to ensure manufacturability and provide a quick quote.
Request a Quote
Engineers From These Verticals Also Build With Us.
Drone & UAV
Flight-controller, ESC, battery and telemetry looms in lightweight silicone fine-strand wire.
VIEW →
Telecom & Datacom
Cat6a/Cat8 patch, SFP/QSFP DAC, MPO fiber and PoE++ assemblies for network equipment.
VIEW →
Data Center
QSFP-DD/OSFP DAC, AOC, MPO/MTP fiber trunks and busbar power for rack-scale systems.
VIEW →Frequently asked questions
What connector pitches can you build to?
We build fine-pitch harnesses on 0.5, 1.0, 1.25 and 2.0 mm pitch with crimp validation on every lot. Wire gauges run to 32 AWG (finer on request) for compact connected-device assembly.
Do you build FFC / FPC and board-to-board links?
Yes. FFC / FPC ribbon and discrete board-to-board interconnect for compact device stacks, with Hirose, JAE and Molex connector systems, length-matched for signal integrity.
What's the minimum order quantity (MOQ)?
50 pieces for a typical data-center assembly. Prototype runs of 1–10 units are billed at sample rate and ship in the first week, so you can validate signal integrity before a production lot.
Can you build sealed industrial-IoT field cordsets?
Yes. Overmolded M12 / M8 cordsets sealed to IP67 / IP68 for IIoT field sensors and edge gateways, in any length, seal- and continuity-tested.
Which connector systems do you terminate?
We hold dies and termination specs for JST, Molex, Hirose, and JAE — including fine-pitch wire-to-board, FFC / FPC and M8 / M12 systems. For proprietary parts, send three free samples and we'll cut dies in week one.
Do you build liquid-cooling harnesses?
Yes. Sensor, leak-detection, and valve-control wiring for CDU and cold-plate manifolds, with sealed / IP-rated terminations where the harness sees coolant proximity. All 100% electrically tested.