Data Center
Custom high-speed cable assemblies and wire harnesses for hyperscale and enterprise data centers — QSFP-DD and OSFP direct-attach copper, internal NVMe and MiniSAS storage links, GPU and rack power whips, and backplane interconnect. Engineered and 100% electrically tested in Taiwan since 1998.
What We Build For Data Centers.
Inside the rack, signal integrity is everything. We've built high-speed copper and power assemblies for server OEMs, switch makers, and hyperscale integrators for twenty-eight years — DAC, internal storage links, and power whips that hold their margin at 112 Gbps.
Our data-center practice spans top-of-rack DAC and breakout, internal NVMe / PCIe and MiniSAS storage interconnect, GPU and busbar power, backplane and board-to-board links, and fan / management harnesses — high-speed signal and high-current power on one bill of materials.
The same line in Taiwan wires all of it — from a feasibility sample to rack-scale volumes. Send a sketch, a BOM, or a competitor sample, and we return a design-for-manufacture review in three business days.
Need Custom Cable Assembly or Wire Harnesses?
Working on a custom project and searching for a trusted manufacturer? Reach out to us for a rapid engineering evaluation and a detailed quote within 24 hours.
3 Product Families Do Most Of The Data Center Work.
High-speed DAC
Passive QSFP-DD / OSFP direct-attach copper, 26–30 AWG twinax, length- and skew-matched for 400 / 800G top-of-rack.
Internal storage interconnect
SlimSAS, MCIO and MiniSAS HD links for NVMe, U.2 / U.3 and PCIe Gen5 backplanes. Length-matched, signal-integrity verified.
Rack & GPU power harness
12VHPWR GPU power, EPS, and C13 / C19 PDU whips with per-pin current balancing and crimp pull-test.
Data Center Assembly Specifications — Baseline.
ELECTRICAL · MECHANICALTWT-01.E
ENVIRONMENTAL · QUALIFICATIONTWT-01.Q
QUALITY · DOCUMENTATIONTWT-01.D
COMMERCIAL · LOGISTICSTWT-01.C
Build Your Cable Assembly
Have a drawing or a BOM? Fill out the form. Our engineers review every submission to ensure manufacturability and provide a quick quote.
Request a Quote
Sketch To Shipment On One Floor
The same engineering team carries your part from the bench through PPAP and into production. No handoffs to another factory.
Drawing review
Send a sketch, BOM, competitor sample, or pinout. Engineering replies within one business day with first-pass feasibility.
DFM feedback
Impedance and skew targets, shield system, connector and backshell alternates. Tooling and NRE quote included in the first round, marked on your drawing.
Sample build
Single-unit or small-batch on the production line, 100% electrical-tested with TDR / eye on request before shipment. Test data sent before pickup.
PPAP / First Article
Dimensional, electrical and materials reports included. Customer drawing markup approval before production release.
Production
100% electrical test on every assembly. Packaged, labeled and shipped per drawing. Optional LA-bonded inventory for monthly delivery schedules.
Engineers From These Verticals Also Build With Us.
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Diagnostic, monitoring and medical-device interconnect, built and 100% tested
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Aerospace
Cabin/IFE, GSE, avionics-test and UAS/eVTOL harnesses with sealed databus interconnect.
VIEW →Frequently asked questions
Can you build 400 / 800G DAC and breakout cables?
Yes. We build passive QSFP-DD and OSFP direct-attach copper and 1×4 / 1×8 breakouts, length- and skew-matched (≤ 5 ps). Every assembly is 100% electrically tested, with TDR and eye-diagram data available on request.
What's the minimum order quantity (MOQ)?
50 pieces for a typical data-center assembly. Prototype runs of 1–10 units are billed at sample rate and ship in the first week, so you can validate signal integrity before a production lot.
Do you build internal NVMe / PCIe Gen5 interconnect?
Yes. SlimSAS and MCIO links for U.2 / U.3 and PCIe Gen5 risers and backplanes, length-matched and TDR-verified. We also build MiniSAS HD (SFF-8643 / 8644) for SAS storage.
Which connector systems do you terminate?
We hold dies and termination specs for TE Connectivity, Molex, Amphenol, Samtec, JAE, and Hirose, plus standard data-center form factors (QSFP-DD, OSFP, SlimSAS, MCIO, MiniSAS HD, 12VHPWR). For proprietary parts, send three free samples and we'll cut dies in week one.
How fast will I hear back on an RFQ?
Our engineering team replies to quote requests within one business day, including feasibility, a tooling/NRE estimate where relevant, and a sample lead time. Send a drawing, BOM, or a description of the application to start.