Samtec High-Speed Wire Harnesses

Rugged High-Speed Samtec Interconnects

For telecom infrastructure, embedded computing, and defense applications, standard pins are often insufficient. TeleWire engineers custom internal wire harnesses utilizing Samtec’s high-reliability contact systems, delivering gigabit data speeds across multiple boards while surviving intense mechanical vibration.

Samtec Technologies Supported:

  • Tiger Eye™ Contact Systems: Beryllium Copper (BeCu) multi-finger contacts designed for high mating cycles and severe shock environments.
  • Discrete Wire & Micro-Rugged: 0.80mm to 2.00mm pitch internal wiring arrays for high-density stacked PCBs.
3 Custom Samtec Wire Harness using FTSH, QMS , and SEARAY Series connectors

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Supported Series & Part Numbers

We maintain extensive tooling and automated processing capabilities for the following industry-standard interconnects. If your specific part number is not listed, contact engineering for 1:1 cross-referencing.

Connector Series Pitch (mm / inch) Key Part Numbers Ideal Application
Samtec Tiger Eye™ Discrete Wire 1.27mm (.050")
SFSDTFSDSFSDTTFSDTTFMSFMSFC
 High-reliability, high-cycle micro board-to-board and wire-to-board routing in severe shock environments.
Samtec Micro Mate™ 1.00mm (.039")
SESDTSEST1MFS1MMS
 Ultra-low profile, high-density discrete wire arrays for compact PCB stacking and spatial constraints.
Samtec Mini Mate® 2.54mm (.100")
IPD1IPT1MMSDMMSSMMTDMMTS
 Individually shrouded, high-reliability isolated power and signal arrays (Up to 4.8A per pin).
Samtec Power Mate® 4.19mm (.165")
IPBDIPBTPMSDPMSSPMTDPMTS
 High-current internal power distribution (Up to 10A) featuring rugged mechanical latching and polarization.
Samtec Edge Rate® Coaxial & Twinax 0.80mm (.031")
ERCDERDPERF8ERM8
 High-speed, impedance-controlled 50-ohm and 100-ohm transmission for networking and edge computing.
Samtec mPOWER® Ultra Micro Power 2.00mm (.079")
UMPTUMPS
 High-power routing (Up to 18A per pin) in an ultra-micro footprint, ideal for aerospace and medical chassis.
Samtec AccliMate™ Sealed Circular & Rectangular (IP68)
SCP3SBP3SCR3SBR3CRP3
 IP68-rated waterproof internal and bulkhead routing for rugged industrial automation and marine environments.
Samtec FireFly™ Micro Flyover High-Speed Copper Flyover
ECUEUEC5UFI
 Bypassing PCB traces to route extreme high-speed data directly to the panel (Up to 28 Gbps per lane).
Samtec SEARAY™ High-Density 1.27mm (.050") Grid
SEACSEAFSEAMSEAF8SEAM8
 Massive pin-count (up to 500 pins) high-speed copper arrays for mezzanine and backplane signal routing.
Samtec Q Strip® & Q Rate® 0.50mm / 0.80mm
HQCDHQDPQSHQTHQSEQTE
 Integral ground plane connections for zero-latency, high-speed board-to-board signal transmission.
Samtec Power Strip™ 5.00mm (.197") / 6.35mm (.250")
PESPETPESSPETTFMPTFMPS
 High-power arrays handling up to 60A per blade for robust blade server and telecom power delivery.
Samtec ExaMAX® High-Speed Backplane 2.00mm (.079")
EBTFEBTMEBDMEBCM
 Elite backplane and orthogonal midplane routing supporting high-density 56 Gbps PAM4 protocols.

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Technical FAQs

Common questions from procurement and engineering teams.

Do you offer impedance testing for Samtec high-speed board-to-board wiring? 

A: Yes. For high-speed data protocols (like internal PCIe or Gigabit Ethernet routing), we perform Time Domain Reflectometry (TDR) testing to guarantee the harness maintains a strict differential impedance (e.g., 85Ω or 100Ω) without signal reflection.

Can you cross-reference Samtec discrete wire components to lower costs? 

A: Yes. While we heavily utilize genuine Samtec components, if you require high-volume cost-downs for commercial products, our engineering team can validate and source precision 1:1 mating equivalents that maintain strict performance standards.

Do you support Samtec micro-coaxial cable assemblies?

A: Yes. We process Samtec's high-speed micro-coaxial interconnects, utilizing automated laser stripping technologies to precisely expose the center conductor and shield without damaging the delicate dielectric layer.

What testing is performed on high-density Samtec discrete wire arrays? 

A: Beyond strict TDR impedance testing, every Samtec discrete wire assembly undergoes 100% automated point-to-point continuity testing, short-circuit detection, and Hipot (dielectric withstand) testing to guarantee flawless board-to-board communication.

Manufacturing Standards & Capabilities

ISO 9001 Certified Factory

TeleWire Technology operates under strict ISO 9001 Quality Management Systems. Every production run undergoes rigorous IQC (Incoming Quality Control) and IPQC (In-Process Quality Control) to ensure consistent, OEM-grade reliability for global supply chains.

IPC/WHMA-A-620 Compliance

Our assembly technicians adhere to IPC/WHMA-A-620 standards for cable and wire harness fabrication. We guarantee precision crimp height, pull-force retention, and strain relief integrity for high-vibration automotive and industrial environments.

100% Electrical Testing

Zero defect policy. 100% of finished assemblies undergo automated testing for continuity, shorts, and mis-wiring. For critical safety applications, we provide advanced VSWR testing, high-pot testing, and insertion force validation.

Custom Component Sourcing

We source genuine connectors from Amphenol, TE Connectivity, Molex, and JST, or provide cost-effective, high-quality equivalents to meet your BOM targets. Our engineering team supports rapid prototyping with low MOQs and fast turnaround times.

Have 2D or 3D drawings ready?

Talk to our engineering team for immediate design validation and DFM (Design for Manufacturing) support.

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